Denver Conference Center

Looking for funding to attend SC23 in Denver?  Here’s two possible opportunities!

It’s well-known that attending conferences, especially premier events in the field of supercomputing, can benefit your work and network.  However, while securing permission to attend might be relatively easy, securing funding to attend can sometimes be much more difficult.  Being able to meet people in your field, learn about new trends, and see the latest technologies can give you a greater edge in your work and your career – and several organisations, including ourselves, realise that supporting those who might otherwise have to pass on such a valuable opportunity gives us the chance to become a much more inclusive space.

Our volunteers did a search of prospective funding opportunities for the upcoming SC23 conference taking place this November in Denver, CO, USA.  We found two potential opportunities for those studying or working at college institutions and early in their career.  Read on to see if one of these pathways may suit you (or someone you know)!

SIGHPC – Travel Support

SIGHPC offers travel grants for students and staff at colleges/universities as well as grants for those early in their HPC career.  They also host a separate travel grant scheme for women who are studying in the field of supercomputing.  These grants are open internationally, and require membership to the SIGHPC institution.  Currently, grant applications are open through September 4th.  Check out their website for all the details.

ACCESS – Community Engagement Fund (US-based)

If you are a US-based student, faculty or staff member for an academic institution the National Science Foundation has set up the ACCESS Community Engagement fund to help individuals travel to large-scale conferences and events.  This program is designed so those wishing to apply do so by contributing knowledge to their overall program as part of the submission process.  Grant applicants for SC23 close on October 1st.  Check out their website for all the details.